TOKYO — In a major boost for silicon-on-insulator technology, Toshiba Corp. will adopt Canon Inc.'s Eltran SOI wafer process for broadband microprocessors built in 0.1-micron and 0.07-micron process ...
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TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have ...
The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...
China's top silicon wafer maker, National Silicon Industry Group (NSIG), has unveiled a major restructuring, taking full control of three loss-making 12-inch wafer subsidiaries. The buyout, valued at ...
It's a sign of the times when top semiconductor makers pool their resources to cover the rising cost of process technology development and fab construction. Providing the strongest evidence of this to ...
The ability to create materials with well-defined characteristics at the micro-and sub-micrometer dimensions is critical in a broad range of research fields and enterprises, from microelectronic chips ...
In an update to its annual International Technology Roadmap for Photovoltaics, German engineering association VDMA discusses the readiness level for various technologies in PV cell and module ...
Fab processes are optimizing for cleanliness, planarity, and high bond quality. Nanotwinned copper and SiCN PVD enable lower anneal and deposition temperatures for HBM. A thin, protective layer helps ...
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