Ultra-precision machining and surface engineering represent critical disciplines in modern manufacturing, enabling the fabrication of components with nanometre-level tolerances and superior surface ...
This Collection supports and amplifies research related to SDG 9: Industry & Innovation. Ultra-precision machining stands at the forefront of advanced manufacturing, enabling the fabrication of ...
Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...
To continue reading this content, please enable JavaScript in your browser settings and refresh this page. A new reality is emerging in precision machining ...
A research team led by Professor Kaiji Sato (Robotics and Mechatronics Laboratory, Department of Mechanical Engineering, Toyohashi University of Technology) revealed a method for designing with ease ...
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