The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
HSINCHU, Taiwan, Sept. 19, 2018 /PRNewswire/ -- Amid over demand from power management components (MOSFET) in booming smart car markets, and addressing the heavy shortage of this segment in supply ...
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