Admit it. You’ve heard a lot about 3D IC’s for years now, and it’s starting to get old. Lots of talk but not much action, you say? Maybe it will never happen, you say? Well, perhaps it’s time to ...

Putting multiple heterogeneous chips is the way forward for improved performance and more functionality, but it also brings a host of new challenges around partitioning, layout, and thermal. Michael ...

In today’s hyperconnected world, the average enterprise juggles more than a 1,000 applications—a number projected to increase dramatically as innovation accelerates. Research firm IDC estimates that 1 ...