A previous EDN article proposed a technique for modifying active-RC-filter-design equations to use exact standard-component values (Reference 1).The main idea was to determine standard-component-value ...
The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...
As chipmakers ramp up the next wave of processes and grapple with how to reduce defect levels, they are encountering problems from an unlikely source—components inside of the fab equipment. Defects ...
High-power dc-dc converters play a critical role in the electrical systems of hybrid electric vehicles (HEVs). These complex modular components provide the link between the low-voltage (14 -V) bus and ...
The world’s biggest chipmakers are coming together to create a new Universal Chiplet Interconnect Express (UCIe) system for integrating chiplets together in future semiconductor designs. Virtually ...
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