Advanced packaging is becoming a key driver of semiconductor progress, focusing less on shrinking transistors and more on how components like memory and logic dies are packaged together for ...

Global Smart Packaging Market to Reach USD 38.36 Billion by 2032, Says MarkNtel Advisors ...

Richard P. Wallace, CEO, outlined that "KLA's results were strong across the board, and we were at or above the high end of our guidance ranges. Specifically, revenue was $3.175 billion. Non-GAAP ...

Kulicke and Soffa Industries recently introduced the ASTERION™-TW ultrasonic terminal welding system and the ProMEM memory-focused interconnect suite, expanding its ASTERION and memory packaging ...

That’s where IC packaging comes in. It’s like the housing for your phone or the case for your computer – it does a lot more ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

The International Test Conference is the electronic industry’s premier event dedicated to the testing of devices, boards, and systems, from design verification to final testing. At this year’s version ...

STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging. The forum ...

DIGITIMES Research analyst Eric Chen notes that process scaling has been the core driver of Moore's Law in semiconductors. However, with short-channel effects emerging, the three leading foundries ...

Needham analyst Charles Shi reiterated Taiwan Semiconductor Manufacturing Co (NYSE:TSM) with a Buy and a $225 price target. Taiwan Semiconductor guided 2025 revenue growth to be in the mid-20s percent ...